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NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS) : FUND RAISING Mi TECHNOVATION BERHAD ("Mi TECHNOVATION" OR "COMPANY") PROPOSED PRIVATE PLACEMENT

MI TECHNOVATION BERHAD

Type Announcement
Subject NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS)
FUND RAISING
Description
Mi TECHNOVATION BERHAD ("Mi TECHNOVATION" OR "COMPANY")

PROPOSED PRIVATE PLACEMENT

We refer to the announcements dated 5 July 2021, 8 July 2021, 13 July 2021 and 14 July 2021 (“Announcements”).

 

(Unless otherwise defined, the abbreviations used throughout this announcement are the same as those previously defined in the Announcements.)

 

On behalf of the Board, Affin Hwang IB wishes to announce that the book building exercise in relation the Proposed Private Placement has been completed on 12 August 2021 by Affin Hwang IB and Maybank Investment Bank Berhad, being the Joint Placement Agents for the Proposed Private Placement. The Company will be issuing 75,750,000 new Mi Technovation Shares, representing approximately 9.23% of the total number of issued shares of the Company (excluding treasury shares), to the placees.

 

The Board has fixed the issue price at RM3.90 per Placement Share (“Issue Price”), which represents a discount of approximately 9.23% to the five (5)-day VWAP of Mi Technovation Shares up to and including 12 August 2021 of RM4.2966 per Mi Technovation Share.

 

This announcement is dated 13 August 2021.






Announcement Info

Company Name MI TECHNOVATION BERHAD
Stock Name MI
Date Announced 13 Aug 2021
Category General Announcement for PLC
Reference Number GA1-12082021-00063




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