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NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS) : FUND RAISING SUNZEN BIOTECH BERHAD ("SUNZEN" OR "COMPANY") PRIVATE PLACEMENT OF UP TO 20% OF THE TOTAL NUMBER OF ISSUED SHARES IN SUNZEN

SUNZEN BIOTECH BERHAD

Type Announcement
Subject NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS)
FUND RAISING
Description
SUNZEN BIOTECH BERHAD ("SUNZEN" OR "COMPANY") 

PRIVATE PLACEMENT OF UP TO 20% OF THE TOTAL NUMBER OF ISSUED SHARES IN SUNZEN

Unless otherwise stated, definitions used throughout this announcement shall carry the same meaning as those defined in the announcement dated 27 September 2021.

 

On behalf of the Board of Directors of SUNZEN, M&A Securities Sdn Bhd is pleased to announce that the Company has fixed the issue price of the first tranche of the Placement Shares at RM0.175 per Placement Share to be issued pursuant to the Private Placement.

 

The aforementioned issue price of RM0.175 per Placement Share represents a discount of approximately RM0.0179 or 9.28% from the 5-day volume weighted average market price of SUNZEN from 8 November 2021 to 12 November 2021 of approximately RM0.1929 per share.

 

This announcement is dated 15 November 2021.






Announcement Info

Company Name SUNZEN BIOTECH BERHAD
Stock Name SUNZEN
Date Announced 15 Nov 2021
Category General Announcement for PLC
Reference Number GA1-15112021-00052




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